TG 30 Thermal Compound 4g
Manufacturer Part #: CL-O023-GROSGM-A
UPC: 841163075845
Thermaltake TG 30 Thermal Compound 4g
$8.99
11 in stock
11 in stock
Description
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs
Additional information
| Weight | 0.13 lbs |
|---|---|
| Manufacturer | Thermaltake |
| Manufacturer Part Number | CL-O023-GROSGM-A |
| UPC | 841163075845 |
